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    Competitive Advantages

    The high-energy, short-duration, adjustable frequency basis of LTT’s microwave burst technology enables thermal processing and bonding of micro-devices at high temperature for short durations.  Moreover, the selective targeting of features and materials within the wafer volume allows energy be absorbed by certain materials while remaining transparent to materials of differing resonant frequencies. 

    Short thermal pulse duration          Reduce defects, increase yield
    High maximum temperature             Improve device performance
    Selective Heating                                Scales as device feature size continues to shrink
    RTP system generates no heat         Eliminates active cooling, lower cost of ownership